Storage Capacity Talks Booked Through 2030! Winbond Electronics Accelerates Expansion Plans

Winbond Electronics has moved up its expansion plan for Module B at its Kaohsiung Luzhu plant, with construction expected to begin in 2027 and equipment installation in 2029, as customer capacity negotiations have already been scheduled through 2029 to 2030. AI-driven storage demand is seen by institutions as likely to "persist for a considerable period." Additionally, Winbond has invested approximately NT$4 billion in its silicon capacitor production line, with mass production targeted as early as 2027, positioning it as a third growth driver beyond logic and memory.