Samsung Opens Advanced Chip Packaging R&D Center in Japan

On September 8, Samsung Electronics launched an advanced semiconductor packaging R&D facility in Yokohama, Japan. Samsung previously announced plans to invest approximately 40 billion yen over five years starting in 2024 to expand the laboratory's research hardware and strengthen its advanced packaging technology capabilities.

This advanced packaging laboratory will collaborate with Japanese local companies, universities, and research institutions to develop next-generation packaging materials and processes. Samsung plans to grow the facility's researcher headcount to over 100 by 2027. (Jinshi)

[TechFlow]