TSMC's 1.6nm-class A16 Process, Designed for AI High-Performance Computing, Targets Q4 Mass Production

TSMC's A16 process has completed development and validation, with mass production expected in Q4 2026. The process adopts "super power rail" backside power delivery technology, moving the power network to the backside of the chip to resolve routing bottlenecks and improve power efficiency. Its key advantage lies in minimizing front-side structural changes, reducing customer design migration costs, and providing an advanced process solution with high energy efficiency and high compatibility for AI and high-performance computing chips.