Samsung Sets 'Three-Phase HBM Roadmap': Toward True 3D ZHBM, Stacking DRAM Directly on Compute Chips
Samsung unveiled a three-phase HBM evolution roadmap at the Hot Chips conference, targeting a "zHBM" architecture that stacks DRAM vertically on top of compute chips. Samsung stated that…
Samsung unveiled a three-phase HBM evolution roadmap at the Hot Chips conference, targeting a "zHBM" architecture that stacks DRAM vertically on top of compute chips. Samsung stated that zHBM can achieve a 70% reduction in power consumption and a 230% increase in bandwidth compared to HBM4E, while freeing up an additional 100W of thermal power headroom for the GPU.
Original: https://wallstreetcn.com/articles/3780121
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