SemiAnalysis: Flash Memory Manufacturing "Shifting from Tungsten to Molybdenum"

SemiAnalysis reports that as 3D NAND flash memory stacking exceeds 300 layers, tungsten word lines hit physical limits in three areas—resistance, chemical compatibility, and deep-hole filling—making molybdenum a mandatory replacement material. Samsung began mass production in 2024, Micron followed in 2025, and SK Hynix plans to launch a 375-layer molybdenum-based product by the end of 2026. The molybdenum deposition equipment market is projected to exceed $1 billion in sales by 2027.